| 摘要 |
PURPOSE:To prevent the oxidation of a copper lead frame and the fusion of solder on the lead frame, to reduce man-hours and to prevent the production of defective products, by heating a semiconductor device with a heater plate having a porous part when the wire bonding of the semiconductor device is performed, and sucking a pellet and the lead frame with the porous part in a vacuum state. CONSTITUTION:A terminal 4 of a pellet 3 and a terminal part 6 of a lead frame 5 are connected with a gold wire 2. At this time, a metal plate part 10 is in contact with the lower surface of the terminal part to be heated. A ceramic porous part 8 having countless air holes are in contact with the other part. A heater plate 7a having such a configuration is used, a region facing the metal plate part 10 is locally heated, and wire bonding is performed. At this time, the lead frame 5 is sucked with a vacuum sucking port 11 which is provided at a heater block 9a having a heater 12 through the countless air holes in the porous part 8. Thus, the floating and warping of leads are suppressed. |
