| 摘要 |
PURPOSE:To form a highly reliable semiconductor device by forming short and long ridges corresponding to the maximum and minimum of a preferable crush width of a bonding in its width direction on a bonding of a metal wire. CONSTITUTION:Two short and long ridges 5, 6 are formed on bondings 3a, 3b in the width direction. The long ridge 5 is formed in the length of 70mum and the short ridge 6 in the length of 40mum. When a metal wire 3 is connected to an electrode pad 2 or an external lead 4, the ridges 5 and 6 appears on the bondings 3a, 3b. This can be observed with naked eyes. It is judged from the ridges 5, 6 whether the crush width of a bonding is within a preferable range. As a result of this, a highly reliable semiconductor device can be formed. |
