首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
PASTE-LIKE SOLDER
摘要
申请公布号
JPH01271094(A)
申请公布日期
1989.10.30
申请号
JP19880097947
申请日期
1988.04.20
申请人
AIWA CO LTD
发明人
NAOI MASAYA
分类号
B23K35/22;H05K3/34
主分类号
B23K35/22
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Battery and battery manufacturing method
Storage device and method for data sharing
2-oxo-1-pyrrolidine derivatives, process for preparing them and their uses
Use of COX-2 inhibitors as gastroprokinetics
Preferentially substituted calcium channel blockers
3-(imidazolyl)-2-aminopropanoic acids
Semiconductor light emitting device and its manufacture
Cultured cells of Ficus stipulata Thunb. (=Ficus thunbergii) and a method for culturing tissues of the Ficus stipulata Thunb. by using said cultured cells
Curl resistant single substrate label sheet and a method for making same
Antisense modulation of focal adhesion kinase expression
Oil or fat composition
Method of characterising a tuneable laser
Objective lens driving apparatus
Optical amplifier for amplifying multi-wavelength light
Optical system adjusting method for energy beam apparatus
Lithographic apparatus, method of manufacturing a device, and device manufactured thereby
Liquid crystal display device
Data compression having more effective compression
Operational amplifier having large output current with low supply voltage
Hardtop vehicle roof with at least two rigid roof parts