| 摘要 |
<p>PURPOSE:To provide the same capability as that of a conventional DIP type handler or a shoot type handler even if a handler using robots is used for a surface mounting type semiconductor element, by providing specified first and second transfer robots. CONSTITUTION:In a first transfer robot 4, the following functions are performed: a semiconductor element sucking chuck 10 is received; a semiconductor element 9 is sucked with said chuck 10 with a vacuum; the semiconductor element 9 is transferred into a measuring station 2 where the semiconductor element 9 is measured; the chuck 10 and the semiconductor element 9 are separated; and the semiconductor element 9 is loaded into the measuring station 2. In a second transfer robot 5, the following functions are performed: the chuck 10 which is loaded in the measuring station 2 is received; the semiconductor element 9 whose measurement is finished is sucked with the chuck with a vacuum; the semiconductor element 9 is transferred into a sorting station 3; and the vacant chuck 10 is returned into a chuck recovering station 6. In addition to said parts, e.g., a chuck feeding station 8 which feeds the semiconductor- element sucking chuck 10, a feeding station 1 which feeds the semiconductor element 9 and the like are provided.</p> |
