| 摘要 |
PURPOSE:To obtain the title copper alloy combining excellent characteristics of both strength and electric conductivity by forming it with the compsn. contg. each prescribed amt. of Ni, P and Si and the balance consisting of Cu with inevitable impurities. CONSTITUTION:The above copper alloy for an electronic equipment contg., by weight, 1.0-8% Ni, 0.1-0.8% P, 0.06% Si and the balance consisting of Cu with inevitable impurities is formed. In the above components, as for the amounts of Ni, P and Si, when Ni:P=about 5:1 and Ni:Si=about 4:1 are satisfied, the level of strength and electric conductivity is most excellent, and they approximately correspond to Ni5P2 and Ni2Si as intermetallic compounds. Since said copper alloy has the above characteristics, it is not only applicable to the wide uses such as a connector, relay and switch including a lead frame material of an integrated circuit, but also is useful as an inexpensive copper alloy. |
