Alloy layer and metallurgy structure for establishing electrical contact.

摘要

An alloy layer (12) contacting portions of a conductive interconnect layer (2) exposed through an overlaying organic insulating layer (4) having apertures therethrough. The alloy contains chromium and titanium, and is formed such that at least 50 atom % of the total content of the alloy is titanium at the alloy-insulating layer interface (6).