| 摘要 |
PURPOSE:To control the shrinkage of copper foils and prevent the generation of creases by thermal fixing by pressure the copper plated surface side of aluminum foils in compliance with the surface of the copper foils between the surface of copper foils applied to an outer layer base and a removal mold surface. CONSTITUTION:A fluorine group resin multi-layer printed wiring board is formed by overlapping an adhesive film 3, for example, a hexafluoroethylene film to the surface of an inner layer base 2 forming inner layer wiring patterns 2a, and also overlapping thereon an outer layer base 1 to which copper foils 1a for forming the outer layer wiring patters with the copper foils 1a on the surface side is applied, and further overlapping aluminum foils 4 applied with copper plating 4a with the copper plated 4a surface side as the copper foils 4 surface, the same is put into a mold 5 of thermal fixing by pressure, laminated and formed. The mold 5 of removal fixing by pressure is slow cooled by controlling the electric heater after laminating. As the linear removal expansion factor of the aluminum foils is smaller than that of the copper foils, the aluminum foils control the shrinkage of coil foils through copper plating by slow cooling to prevent the generation of creases. |
