发明名称 |
REMOVAL OF EXCESS MATERIAL FROM A SEMICONDUCTOR WAFER |
摘要 |
<p>A system for removing excess material from a semiconductor wafer employs an excimer laser for ablative photocomposition. A wafer is positioned on an X-Y stage that is computer controlled to position the wafer at points where the laser may be focused to remove excess material whether over alignment marks or identified contamination. The laser passes through a vacuum chamber ending in a nozzle structure which by generating an inward laminar flow constrains any particulate contamination resulting from the ablative photodecomposition from spreading. This material is removed by the vacuum system.</p> |
申请公布号 |
EP0247331(A3) |
申请公布日期 |
1989.10.11 |
申请号 |
EP19870104937 |
申请日期 |
1987.04.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ROSENFIELD, MICHAEL GERALD;SEEGER, DAVID EARLE |
分类号 |
H01L21/027;B23K26/14;G03F1/72;G03F7/42;H01L21/30;(IPC1-7):G03F7/26 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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