| 摘要 |
Curable compositions with improved humidity resistance are composed of an active hydrogen-containing resin which is essentially free of glycidyl groups, a curing agent present externally and/or internally as a part of the active hydrogen-containing resin, and a catalytic amount of a sulfonic acid having a molecular weight of less than 500 and represented by the following structural formula: <IMAGE> wherein: Z is a radical independently selected from C1 to C20 alkyl, C3 to C20 cycloalkyl, C6 to C18 aryl, halogen, alkoxy, and aryloxy; R is independently selected from hydrogen, C1 to C20 alkyl, C3 to C20 cycloalkyl and C6 to C18 aryl; y is an integer from 0 to 4; w is an integer from 0 to 2; x is an integer from 1 to 3, with the proviso that when w is 0, y is an integer from 1 to 4 and x is an integer from 2 to 3 and when y is 0, w is an integer from 1 to 2 and x is an integer from 1 to 2. |
