发明名称 EXTRUSION FORMULATION PACKAGE FOR THERMALLY SENSITIVE RESINS AND POLYMERIC COMPOSITION CONTAINING SAID PACKAGE
摘要 <p>The present invention is a polymeric composition which comprises a vinylidene chloride interpolymer blended into a mixture with an extrusion formulation package, said vinylidene chloride interpolymer being present in an amount of from 59.8 and 99.7 weight percent and said formulation package being present in an amount of from 0.3 and 40.2 weight percent. The formulation package comprises from 0.05 to 5 weight percent of an alkali metal salt or alkaline earth metal salt of a weak acid; and the remainder of the formulation package comprises at least two components selected from the group consisting of (a) a polyethylene containing up to a minor amount of a comonomer, said polyethylene being capable of lowering the frictional coefficient of a polymeric composition containing a polyvinylidene chloride interpolymer; (b) a plasticizer; and (c) at least one external lubricant selected from the group consisting of (i) oxidized polyolefins, and (ii) polyolefin waxes or oils.</p>
申请公布号 WO1989008680(A1) 申请公布日期 1989.09.21
申请号 US1989000887 申请日期 1989.03.04
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