发明名称 |
MULTILAYER CERAMIC PACKAGE WITH HIGH FREQUENCY CONNECTIONS |
摘要 |
<p>A multilayer ceramic package is disclosed which includes a high frequency interconnect (10) that simulates the performance of a conventional coaxial connector. The interconnect comprises a signal conductor (30) surround by the ceramic material (18, 20) forming the package. A plurality of vias (22, 24) are formed through the ceramic material so as to surround the conductor. These vias are then connected to a ground plane (14, 16) to form the outer shielding for the high frequency interconnect.</p> |
申请公布号 |
EP0309942(A3) |
申请公布日期 |
1989.09.20 |
申请号 |
EP19880115677 |
申请日期 |
1988.09.23 |
申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
SMELTZ, PALMER DANIEL, JR. |
分类号 |
H01L23/08;H01L23/498;H01L23/66;H01P1/04;H01P3/06;H01P3/08;H01P5/08;H05K1/00;H05K1/02;H05K1/03;H05K1/11;(IPC1-7):H01L23/56 |
主分类号 |
H01L23/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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