| 摘要 |
PURPOSE:To prevent the possibility of generation of irregularities in the surface while obviating the possibility of the generation of trouble in the formation of a circuit by superposing through prepregs a plurality of metallic plates, to which through-holes are shaped, while stacking a circuit-board onto the outside surface of the metallic plate as an outermost layer through a prepreg and laminating and bonding the stack. CONSTITUTION:Several metallic plates 2, 2... to which through-holes 5 are formed are superposed through prepregs 3, 3... while circuit-boards 6 are stacked onto the outside surfaces of the metallic plates as outermost layers through prepregs. The stack is heated and pressure-molded, a resin impregnated to the prepregs is cured, and each metallic plate and internal-layer circuit-boards 12 are laminated and cemented alternately while the circuit-boards are laminated and bonded onto the outside surfaces of the metallic plates as the outermost layers. The resin infiltrated in the prepregs is made to flow and filled into respective through-hole in the metallic plates and cured at the same time. The greater part of the resin contained in the prepregs laminated on the outsides of the metallic plates as the outermost layers flows into the through- holes in the metallic plates, but indentations in the sections of the through-holes in the metallic plates do not appear on the surfaces because the circuit-boards having rigidity are laminated on the outside surfaces. |
