| 摘要 |
A film peeling apparatus for peeling a film from a substrate comprises film raising means for raising a part of the film from the substrate, and fluid jetting means for jetting fluid into between the film thus raised and the substrate, the film raising means including a brush or an adhesive member, so that the film the part of which has been raised from the substrate can be readily, positively and instantaneously peeled from the substrate by jetting the fluid.
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