| 摘要 |
A solder assembly for facilitating soldering operations includes a stand having a pivotally mounted soldering iron rack for receiving and supporting a soldering iron plugged into a power outlet socket on the stand during periods of non-use. The soldering iron rack is arranged to operate a switch upon withdrawal of the soldering iron from the rack for use to activate a motor driven fan housed in a hood supported above the stand by an articulated member on the stand. The fan upwardly sucks the noxious gases produced by the soldering process through an activated charcoal filter positioned an a trumpet-shaped air passage defined by the hood for discharge through a nozzle rotatably and angularly adjustably mounted in the exhaust outlet port of the hood. A lamp manually energized by a separate switch is provided in the hood to illuminate the work area. A sponge pad and a solder reel support strut are provided on the stand. A manual switch on the stand permits operation of the fan with the soldering iron positioned in the rack.
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