发明名称 Electroless deposition employing laser-patterned masking layer
摘要 A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.
申请公布号 US4865873(A) 申请公布日期 1989.09.12
申请号 US19870129854 申请日期 1987.12.07
申请人 GENERAL ELECTRIC COMPANY 发明人 COLE, JR., HERBERT S.;LEVINSON, LIONEL M.;LIU, YUNG S.;SITNIK, THERESA A.
分类号 C23C18/16;H05K3/00;H05K3/18 主分类号 C23C18/16
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