发明名称 |
Electroless deposition employing laser-patterned masking layer |
摘要 |
A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.
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申请公布号 |
US4865873(A) |
申请公布日期 |
1989.09.12 |
申请号 |
US19870129854 |
申请日期 |
1987.12.07 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
COLE, JR., HERBERT S.;LEVINSON, LIONEL M.;LIU, YUNG S.;SITNIK, THERESA A. |
分类号 |
C23C18/16;H05K3/00;H05K3/18 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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