| 摘要 |
PURPOSE:To mount an element having many signal terminals by a structure wherein a lead frame is divided into two parts of an upper-section part and a lower-section part so that bonding wires cannot be crossed. CONSTITUTION:A semiconductor element 1 is mounted on a cavity part 2-1 in a ceramic substrate 2; an inner-lead lower section 3-1 and an inner-lead upper section 3-2 of a lead frame are pressure-bonded by using crystallized glass 4. The semiconductor element and inner leads are wire-bonded and made conductive; after that, they are sealed airtight by a ceramic lid body 6 by using low-melting-point glass 7. The lower section 3-1 and the upper section 3-2 of the inner leads are arranged radially with reference to the central part of the element or an arbitrary point at the inside of the element. In this case, a difference between the upper section and the lower section of the inner leads is preferably to be 0.2-0.5 mm. |
