LEAD TYPE CHIP CAPACITOR AND PROCESS FOR PRODUCING THE SAME

摘要

A lead type chip capacitor which is disclosed herein comprises a capacitor chip having a lead terminal bonded thereto through a joining or bonding layer made of a highly melting metal paste. The lead type chip capacitor is produced by bonding at least one internal electrode in a capacitor chip with a lead terminal by a metal paste, drying them at a temperature in a range of 100 DEG to 200 DEG C., and firing the resulting capacitor chip with the lead terminal bonded thereto at a temperature in a range of 500 DEG to 900 DEG C. in the air or in a nitrogen atmosphere.