| 摘要 |
<p>PURPOSE:To suppress the generation of voids and to prevent protruding and sharpened parts or the like from being generated by forming an inner edge part of an external semiconductive layer with a semiconductive composition thereafter heating a joint part wholely to be molded. CONSTITUTION:Conductor connection of cables F, F is performed, and winding a semiconductor tape on this connection part heating it to be melted and bridged, a bridged internal semiconductive layer 4 is formed. Thereafter in this part, an unbridged cross-linking agent-contained composite tape is wound, forming an insulator 6, and winding on its periphery the semiconductive tape, two-parts divided external part semiconductive layers 7, 8 are formed. Here suitably applying heat treatment, each external part semiconductive layers 7, 8, especially the part of an inside edge part 7a, sets its gelation factor to a range of 10-50%. On the external part semiconductive layers 7, 8 thus formed, further a retaining rape 10 is wound for retaining the layer, thereafter setting a metal mold for molding, the layer is guided to the final cross linking degree by pressure heating. By the method thus obtained, adhesiveness of the edge part and a shape holding quality are improved.</p> |
