| 摘要 |
<p>PURPOSE:To improve the workability and reliability of an outer lead bonding by so providing a frame at the lower part of a tape as for outer leads as not to protrude from the tape, or further bending the leads to the rear face of the frame. CONSTITUTION:A frame member 6 is so provided on the periphery of a device hole 3 on the rear face of a tape 1 as for outer leads 4' extending from a resin sealed part 8 as not to protrude from the edge of the tape 1, and the lower face of the member 6 is disposed in the same plane as that of the lower face of the chip 5. The leads 4 are bent from the tape 1 and the side face of the member 6 to the rear face of the member 6 and provided therealong. Then, the leads 4' are mounted on the conductor wirings 10 of a mounting board 9, while a tape carrier is mounted by mounting the leads 4' provided along the rear face of the member 6 by solder 11 on the windings 10 of the board 9. The member 6 to be used is formed, for example, of polyimide series synthetic resin or glass epoxy resin.</p> |
