INTEGRATED CIRCUIT CHIP ASSEMBLY

摘要

This invention relates to an integrated circuit chip assembly wherein at least one integrated circuit chip (e.g., 46-48, 49) is attached to a substrate (e.g., 28) of a single crystal material, said at least one chip being electrically connected to lithographically connected circuitry (e.g., 50-54) on the substrate. The chips may be on top or on the bottom of the substrate or both, may be placed within wells or grooves in the substrate or may be placed above or below the wells or grooves via peripheral attachment of the chips. Walls of the wells or grooves permit alignment by match-up with beveled edges of some chips. Circuitry may be also applied to the walls of some wells to permit connections to chips secured below the substrate.