Semiconductor wafer transfer apparatus with back-to-back positioning and separation

摘要

An apparatus is disclosed for the bulk transfer of semiconductor wafers from container to container for processing in the back-to-back configuration. The apparatus includes a stage (12) for selectively raising the wafers from a boat (14) upward into a retaining mechanism (18). The wafers are confined in a back-to-back configuration through a slot (64) in the end of a back-to-back retainer (34). The back-to-back configured wafers are then removed, processed and then disposed back in the retaining mechanism (18). The back-to-back wafers are aligned with an alignment slot (76) in a preseparation retainer (36). The preseparation retainer (36) provides both alignment and a slight preseparation with respect to a separation retainer (38). The separation retainer (38) has a separation edge (118) which separates the back-to-back configured wafers into slots (104) and (108). The wafers are then removed after separation thereof.