发明名称 Apparatus for thermal treatments of thin parts such as silicon wafers
摘要 PCT No. PCT/FR87/00043 Sec. 371 Date Dec. 14, 1987 Sec. 102(e) Date Dec. 14, 1987 PCT Filed Feb. 18, 1987 PCT Pub. No. WO87/05054 PCT Pub. Date Aug. 27, 1987.An apparatus for the thermal treatment of a thin part (1) includes a thermal light source including linear lamps (17) of very high unitary power such as "tungsten-halogen" lamps, and a housing (2) containing the part to be treated. The apparatus includes inside the housing (2) a chamber (4) delimited by the sidewall and the bottom (3a) of the housing as well as by a silica window, making it possible to create about the part to be treated particular conditions for thermal treatment. Within the treatment chamber there is arranged a compensation means (22a) for the thermal losses of the part to be treated. The thermal light source is configured like a light box (16a) by superimposing several modules (43) having a polygonal cross-section.
申请公布号 US4857704(A) 申请公布日期 1989.08.15
申请号 US19870123858 申请日期 1987.11.20
申请人 BERTIN & CIE 发明人 JANNOT, MARCEL A. J.;PATUREAU, JEAN-PIERRE
分类号 H01L21/26;C21D1/34;C23C16/48;C30B33/00;F27B17/00;H01L21/00;H05B3/00 主分类号 H01L21/26
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