| 摘要 |
<p>PURPOSE:To prevent a post flux from ascending up to the face of a printed board provided with no conductive foil so as not only to protect an electrical component against corrosion but also prevent a defective contact from generating in the electric component through a simple structures by a method wherein a fluorine surface active agent is applied around an inserting hole of the printed board before a post flux applying process. CONSTITUTION:A fluorine surface active agent 13 is applied around an inserting hole on the other face opposite to the face of a printed board 14 where a conductive foil is provided, where the inserting hole is provided to the printed board penetrating the conductive foil. Next, a leg of an electric component 3 is inserted into the inserting hole of the printed board 14, a post flux 12 is applied onto the conductive foil provided face of the printed board 14 provided with the electric component 3 whose leg is inserted into the hole. Then, the post flux applied face of the board 14 is heated to dry up, and a dip soldering is performed onto the printed board 14 which is already through a heating and dry process. By these processes, a post flux is prevented from ascending up to the face not provided with the conductive foil 11, and a post flux is assuredly prevented from soaking into an electric component in the following soldering process.</p> |
