| 摘要 |
<p>PURPOSE:To inhibit the cracking of a scribing line by providing a protective film separated from a protective film formed onto a semiconductor element to a predetermined section of a scribing-line and dicing the separated protective film section. CONSTITUTION:A semiconductor element 2 is formed onto a semiconductor wafer 1, and a protective film 3 for protecting the element 2 is shaped onto the surface of the element 2. A protective film 31 separated from the protective films 3 for protecting the surfaces of the elements is shaped at approximately the central section of a scribing line 4 between the adjacent elements 2. Consequently, the protective film 31 on the line 4 relaxes or absorbs excessive force applied to the wafer 1 on dicing. Accordingly, the cracking of the scribing line is inhibited.</p> |
