A thermoelectric heat pump having first and second substrates with first and second copper metalizations formed thereon. The first and second copper metalizations are coated with nickel for soldering with a 90-100 lead-antimony solder having a eutectic temperature of about 251 degrees Celsius to nickel plates coated on first and second ends of n-type and p-type thermoelectric elements. The n-type and p-type semiconductor elements are arranged in an array of rows and columns with alternatively n-type and p-type elements connected in series with a first n-type element having a lead for connection to first terminal of a dc power source and a last p-type element having a lead for connection to a second terminal of a dc power source. The solder being of a composition that is both chemically and physically inactive with respect to the thermoelectric material for preventing the formation of regions of poor thermoelectric characteristics in the thermoelectric material and electrical shorts on the thermoelectric material.
