| 摘要 |
PURPOSE:To eliminate a short-circuit malfunction due to the displacement of bonding and to improve the reliability of a semiconductor device by removing part of a guard ring near an outer terminal. CONSTITUTION:A guard ring 8 made of aluminum surrounds electrode groups 4, 5, part of which is connected to a collector n<+> type layer 9 at the periphery of a substrate, the ring is removed near the bonding pad 6 of the base, but the ring 8 is so formed as to surround the base electrode 4 which does not become a bonding pad in the other part. When the ring is removed near the pad, it is not short-circuited with the ring even if the bonding is displaced. The area of the base can be extended at the part where the ring is removed to be advantageous in its characteristic. |
