| 摘要 |
PURPOSE:To decrease mismatch of characteristic impedance and improve high- frequency characteristics by providing a void part between conductive parts formed on one substrate forming a wiring intersection part structure by stacking substrates and conductors formed on another substrates. CONSTITUTION:In a multilayer interconnection substrate constituted by stacking two or more substrates 3, 4 provided with conductive parts 3b, 4b having a predetermined line width, a substrate 5 provided with a through hole 5a is disposed between substrates 3, 4 at a position corresponding to the wiring intersection part formed by stacked substrates 3, 4. Accordingly, the conductive part 3b and the conductive part 4b are interconnected with a void part 5a formed on the substrate 5, and air of very low permittivity is interposed therebetween, reducing the value of electric capacity to a minimum. This makes it possible to prevent mismatches of characteristic impedance and crosstalks. |
