| 摘要 |
<p>PURPOSE:To easily change combinations of functions without enlarging a mounting area by bending an external lead terminal of a socket crosswise first then upwards, and by providing a recess to a mold outside corresponding to the external lead terminal. CONSTITUTION:A semiconductor device is formed by a conventional technique until a metal fine line for a semiconductor element mounted on a lead frame is made. Afterwards, molding is conducted to make a recess 4a in a root section of a lead terminal which is a part of a number of lead terminals 1a so that it becomes a socket section of the other semiconductor device. Then the lead frame is cut and an external lead terminal 1b which becomes a socket section is bent upwards to be fixed easily. The other external lead terminal 1a is bent downwards. In this way, combinations of each function can be changed arbitrarily and readily thus corresponding to a variety of requirements rapidly without enlarging a mounting area.</p> |
