发明名称 METHOD OF FORMING FUSIBLE LINKS IN A SEMICONDUCTOR DEVICE
摘要 A method of producing a semiconductor device provided with a fuse comprises the steps of forming a fuse layer (34) on an insulating layer (32) lying on a semiconductor substrate (31); forming an interrupting layer (40) covering the fuse layer and the insulating layer; forming an insulating protective layer (43) covering the interrupting layer; selectively etching the protective layer, so as to form a partial window (55), with a suitable etchant which does not etch the interrupting layer (40); and etching the exposed interrupting layer to complete the window (56) through which a portion of the fuse layer (34) and a portion of the insulating layer (32) are exposed. The insulating layer (32) is not removed, so that the reliability of the semiconductor device will not deteriorate.
申请公布号 DE3379929(D1) 申请公布日期 1989.06.29
申请号 DE19833379929 申请日期 1983.03.17
申请人 FUJITSU LIMITED 发明人 YABU, TAKASHI;KANAZAWA, MASAO
分类号 G11C17/06;G11C17/14;H01L21/82;H01L21/8242;H01L23/525;H01L27/10;H01L27/108;(IPC1-7):H01L23/52;H01L21/90 主分类号 G11C17/06
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