Self-limiting mask undercut process.

摘要

A process for manufacturing GaAs FET's having refractory metal gates provides for reducing the size of the gate relative to a mask by an etch sequence which results in precisely controlled and repeatable self-limited undercutting of the mask. A reactive ion etch of the refractory metal in a CF4O2 plasma containing an inert gas provides the self-limiting undercut at a pressure in the range of 175-250 mTorr when the power is less than 0.15 W/cm<2>. Preceding the undercut, an anisotropic RIE in a CF4 plasma can be employed to clear unmasked areas of the refractory metal and an initial sputter cleaning in argon improves the quality of the initial etch.