| 摘要 |
PURPOSE:To obtain a printed wiring board for a high frequency with a little power loss by forming a wiring pattern on the surface of one side of a dielectric in a sheet shape, in which the whole surface is electroless-plated, by means of an etching, and leaving a copper on the other surface in executing no etching. CONSTITUTION:For a dielectric 1, materials such as a ceramic and a polytetrafluoroethylene with a little dielectric loss in the high frequency exist. A layer 12 of the copper is formed on the whole of the surface of the dielectric 1 by an electroless copper plating, thereafter, for the surface of one side, an unnecessary part is removed by the etching, etc., a wiring pattern 2 is formed, and for the other surface, the copper is left as a grounding metal 7. Except for a part 3 connected to electronic parts, the solder resist of a composition hard to be eroded by a plating solution and to permanently remain is formed as a plating mask. An electrolytic or electroless plating by a nickel as a substrate metal 4 is executed, and thereafter, the electrolytic or electroless plating by an oxidation-resistant metal 5 such as a gold, a platinum, a cobalt or the alloy of them is executed. |
