| 摘要 |
<p>The socket has a socket substrate (1) including an IC package accommodating section (1a), and a contact (1b) for a contacting terminal (5a) of the IC package (5) which is accommodated in the IC package accommodating section. The socket includes a seesaw lever (3) for pushing up the IC package. The seesaw lever is formed at its one end with an IC package push-up lever portion (3b) disposed below the IC package accommodated in the IC package accommodating section and at its other end with a push-down lever portion (3c). The IC package push-up lever portion and the push-down lever portion are able to move up and down in turn like a seesaw motion balancing on a support (1c) disposed at the center between both levers. The socket substrate is provided with push-down means (2f) for rendering a push-down force to the push-down lever portion. The push-down means pushes down the push-down lever portion to spring up the IC package push-up lever portion, so that the IC package will be pushed up.</p> |
