| 发明名称 |
METHOD OF FORMING SOLDER INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES |
| 摘要 |
Arrays of solder interconnections between a semiconductor device (10) and a supporting substrate (12) are annealed for a time in excess of one or several days below the solder melting temperature to relief stress and improve the fatigue failure of the interconnections. |
| 申请公布号 |
DE3570154(D1) |
申请公布日期 |
1989.06.15 |
| 申请号 |
DE19853570154 |
申请日期 |
1985.06.13 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LEVINE, ERNEST NORMAN;LIPSCHUTZ, LEWIS DRUCKER;QUINONES, HORATIO |
| 分类号 |
H05K3/34;C25D21/14;H01L21/60;(IPC1-7):H01L21/92;H01L21/324 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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