| 发明名称 |
COPPER COLLOID AND METHOD OF ACTIVATING INSULATING SURFACES FOR SUBSEQUENT ELECTROPLATING |
| 摘要 |
The invention relates to colloidal copper solutions containing palladium useful for activating non-conductive substrates for subsequent electroless and electrolytic plating. |
| 申请公布号 |
DE3177050(D1) |
申请公布日期 |
1989.06.15 |
| 申请号 |
DE19813177050 |
申请日期 |
1981.11.20 |
| 申请人 |
LEARONAL, INC. |
发明人 |
BRASCH, WILLIAM ROBERT |
| 分类号 |
C23C18/28;(IPC1-7):C23C18/28 |
主分类号 |
C23C18/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
