发明名称 HIGH DENSITY JOINING METHOD BETWEEN SMALL DIAMETER ALUMINUM TUBE AND MANIFOLD
摘要 PURPOSE:To join a large-scale structure by covering the whole rear side of the inserting surface of a manifold with a quartz glass cover, introducing an Ar gas inside the manifold, and successively moving the heater over the whole surface while rapidly heating the manifold from the outside of the cover by means of a heater and soldering it. CONSTITUTION:The both edges of a small diameter Al tube 1, which is Cu- or Ag- plated, are respectively inserted to the clustered mounting holes of an Al manifold 2, solder is attached to an inserting joint part, and the whole rear side of the inserting surface of the one manifold 2 is covered with a quartz glass cover 3. An Ar gas 4 is introduced between the rear surface of the manifold 2 and the said cover 3, an infrared heater 5 is applied from the outside of the cover 3 to the edge part of the manifold 2, the local part is quickly heated, and the tube edge at the part and the mounting hold are soldered. The heater 5 is successively moved over the whole surface, the local rapid heating is executed over the whole surface, and the soldering to the whole fitting part is completed. Next the local rapid heating is executed for the whole surface of the other manifold 2 in the same way, and the tube assembly structure is completed.
申请公布号 JPH02205255(A) 申请公布日期 1990.08.15
申请号 JP19890013473 申请日期 1989.01.23
申请人 MITSUBISHI HEAVY IND LTD 发明人 SAKAMOTO AKIRA;HASEGAWA HIDETO;ONDA TAKASHI;FUJIWARA TSUTOMU
分类号 B23K1/00;B23K1/005;B23K101/06 主分类号 B23K1/00
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