| 摘要 |
PURPOSE:To obtain titled composition capable of giving cured products of low shrinkage and high adhesiveness and water resistance, suitable for electronic parts sealing, by incorporating a curable resin composition comprising epoxy compound and photopolymerizable compound with saturated polyester resin soluble in said resin composition. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of a curable resin composition comprising (i) epoxy compound having, in one molecule, at least two epoxy groups (pref. bisphenol A diglycidyl ether), (ii) photopolymerizable compound having, in one molecule, COOH group (pref. monoacryloyloxy ethyl succinate) or (iii) a mixture of the compound (ii) and another photopolymerizable compound (e.g. styrene), and (iv) photoinitiator (e.g. 2-hydroxy-2-methyl propiophenone) with (B) pref. 5-60% of a saturated polyester resin soluble in the component (A) (e.g. derived from saturated polycarboxylic acid and polyhydric alcohol). |
