发明名称 SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PURPOSE:To surely change over the output of a laser light and to prevent the effect of heat by providing the cutoff part cutting off the optical path of the laser light by a mirror and the cooling part cooling the heat of the laser light causing this cutoff. CONSTITUTION:Interception parts 8a, 8b capable of cutting off a laser light by a mirror, e.g., a galvano/scanner as a mirror rotary type shutter, are provided on the optical path of a laser light to absorb the laser light reflected by the mirror of this interception part. This cutoff laser light is cooled by the cooling parts 9a, 9b cooling by water, forced air cooling or natural air cooling, e.g., by the Al made heat sink subjected to black color almite processing. The sure interception of the laser light can be executed by instantaneously changing over the output of the laser light to 100% from 0% and executing the processing of a wafer 2 by the laser light and the heat effect onto the vicinity of the interception part, etc., can be prevented. The diffusion of the laser light, etc., can be prevented as well.
申请公布号 JPH01148485(A) 申请公布日期 1989.06.09
申请号 JP19870305277 申请日期 1987.12.02
申请人 TOKYO ELECTRON LTD;MITSUBISHI ELECTRIC CORP 发明人 NISHIMURA TADASHI;KUMAGAI HIROMI;YONEYAMA SHIMAO
分类号 G03F7/20;B23K26/00;B23K26/06;G02B26/02;H01L21/20;H01L21/268;H01S3/00;H01S3/10;H01S3/101 主分类号 G03F7/20
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