| 摘要 |
<p>PURPOSE:To contrive to increase the yield of semiconductor element by lessening the deflection of a blade and consequently narrowing the width of a kerf despite the increase of the plate thickness of a wafer by a method wherein cut grooves are made by sawing from both the sides of the wafer of semiconductor. CONSTITUTION:A wafer 1 of semiconductor is fixed onto a stage 2. Next, sawing blades 3 and 6 are respectively fixed to blade holders 4 and 7 so as to be rotated about spindle shafts 5 and 8 in order to saw the wafer 1 of semiconductor from its both sides for breaking and separating the wafer 1 along kerfs into respective chips. Accordingly, despite the the increase of the plate thickness of the wafer 1, the sum of the kerf losses of the respective sawing blades 3 and 6 can be checked smaller than the kerf loss of a single sawing blade. Furthermore, the lateral deflection of the blade becomes smaller, resulting in allowing to prevent the breakage accident of the sawing blade from occurring.</p> |
