| 摘要 |
PURPOSE:To avoid the swelling of resin and prevent the defective connection of a bonding wire by soldering a lead terminal to a substrate, immersing it in an organic solvent for cleaning, then coating a bare pellet with resin. CONSTITUTION:A substrate 1, a bare pellet 2 and a bonding wire 3 are connected for wiring, a lead terminal 5 is coupled with the substrate 1, and solder paste is coated. A transparent shielding plate 7 is inserted between the lead terminal 5 and the bare pellet 2 so that no flux or solder ball is stuck to the bare pellet 2, and laser is radiated to the solder paste 6 to melt it. This substrate 1 is immersed in an organic solvent as it is, the stuck flux or solder ball is removed, the bare pellet 2 is coated with silicon resin 4, then the whole substrate is coated with armoring resin 8. The swelling of resin can be avoided at the time of cleaning, and the defective connection of the bonding wire 3 is prevented. |
