发明名称 DIE BONDING APPARATUS
摘要 PURPOSE:To uniformly apply a pressure even when a posture is changed and to enhance the reliability of connection strength by using a rotary pair which does not generate a restoring force even when the posture is displaced due to a centering operation ot a remote centering mechanism. CONSTITUTION:Bearings are used for rotary pairs 10-13 so that the pairs cannot generate a restoring force of a spring. Accordingly, if a parallel error exists between a die 18 and a base 5, the die 18 is turned around a center O structurally, and the parallel error is adjusted automatically. However, when the center of gravity 21 of a centering mechanism is displaced from a vertical line of the center O due to a change in a posture, the die 18 is tilted to a mechanical limit position if the die 18 is not brought into contact with the base 5. As a method to offset a moment due to the center of gravity and to maintain an initial posture of the die 18, an electric current is impressed on coils 27, 28 from an electric-current control circuit 23 in a state that the die is not pressurized; a balance of force is established at the center due to an action of a magnetic force of the coils 27, 28 and a magnet 29; when the die is tilted, a restoring force is actuated strongly; as a result, the initial posture can be maintained. By this setup, it is made possible to execute a more uniform pressurization operation.
申请公布号 JPH01140732(A) 申请公布日期 1989.06.01
申请号 JP19870297523 申请日期 1987.11.27
申请人 HITACHI LTD 发明人 ARAI SHINICHI;TAKAHASHI MICHIRO;MITA TORU
分类号 H01L21/52 主分类号 H01L21/52
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