发明名称 MANUFACTURE OF LAMINATED PLATE FOR PRINTED CIRCUIT BOARD
摘要 <p>PURPOSE:To enhance the bonding strength between a metal foil and a fluoric resin impregnated base material, by bonding a material which is obtained by applying a powdery adhesive agent to the metal foil, to the opposite sides of a laminate of several fluoric resin-impregnated base materials, and molding the same while applying heat and pressure thereto. CONSTITUTION:A base material 2 is soaked and impregnated in a dispersion of fluoric resin, dried by an infrared ray and sintered. Several sheets of the fluoric resin- impregnated base materials 2 are then laminated one after another, to the opposite sides of which is bonded a material obtained by applying a metal foil 1 to a powdery substance 3 of fluoric resin. Then, the laminated base material 2 applied with the powdery substance 3 is molded with heat and pressure. As the above powdery substance 3, other than ethylene tetrafluoride.propylene hexafluoride copolymer, ethylene tetrafluoride perfluoroalkylvinyl ether copolymer, fluoric resin may be employed. As described above, since the powdery substance of fluoric resin is employed as an adhesive agent when the fluoric resin-impregnated base material and the metal foil are bonded each other, the contacting area between the metal foil and the fluoric resin is increased thereby enhancing the bonding strength.</p>
申请公布号 JPH01136740(A) 申请公布日期 1989.05.30
申请号 JP19870295788 申请日期 1987.11.24
申请人 TOPPAN PRINTING CO LTD 发明人 SUZUKI YUKIO;OTA KAZUHIKO;KAGAMI TAKASHI
分类号 B32B38/00;B32B15/08;B32B37/10;H05K1/03;H05K3/02 主分类号 B32B38/00
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