| 摘要 |
PURPOSE:To render a semiconductor device thinner by a method wherein a lead and a suspension lead are built of a metal foil, a prescribed spot on the lead is covered by a non-conductive film, the leads are formed thinner, and the need of bonding wires is eliminated. CONSTITUTION:A semiconductor device of this design is constituted of a semiconductor pellet 1 sealed in a package, a lead 5a with one end connected to the pellet 1 and the other end extending out from the package, and a suspension lead 5b installed on the upper surface of the pellet 1. The lead 5a and the suspension lead 5b are constituted of a metal foil. A specified spot on the lead 5a is covered by a non-conductive film 7. In such a design, the lead 5a and the suspension lead 5b may be thinner and bonding wires are not needed, both contributing to a further reduction in thickness of the semiconductor device. |
