| 摘要 |
PURPOSE: To obtain copper conductor ink which has excellent adhesion and is useful for the manufacture of a multilayered integrated circuit structure by mixing an adhesion improving oxide in the ink in addition to devitrifying glass frit selected out of specific mixtures. CONSTITUTION: The copper powder mixed in copper conductor ink is pure copper powder of about 1-5μm in grain size and the mixing ratio of the power is adjusted to about 65(wt.)% to about 85(wt.)%. The devitrifying glass frit also mixed in the ink is prepared by mixing zinc, calcium, and aluminum silicate and/or zinc, magnesium, barium, and aluminum silicate in glass at an arbitrary ratio and it is preferable to set the mixing ratio of the glass frit to about 2(wt.)% to about 10(wt.)%. Since the glass frit has a very high softening point, it becomes unnecessary to treat the ink with oxidizing or reducing plasma before baking. In addition, the coefficient of thermal expansion of the glass frit is close to that of alumina, the ink is suitably used for alumina circuit boards. The ink also contains an adhesion improving oxide, such as bismuch oxide, etc. |
