| 摘要 |
PURPOSE:To enhance contact adhesion performance between an insulating film and a wiring conductor and to enhance reliability of moistureproofness at an interface by a method wherein a mixed layer composed of the insulating film containing a hydropholic group and of a metal material constituting the wiring conductor is provided at a boundary part between the wiring conductor and the insulating film. CONSTITUTION:While the surface of a polyimide film 2 is being irradiated by a plasma of individual gases of helium and oxygen and, in succession, the surface of a polyimide is being irradiated with ions of helium, Al is electron- evaporated; after the evaporation, a photoetching operation is executed and a wiring conductor 4 of Al is formed. In addition, a process identical to this is repeated and an Al wiring part is laminated; an LSI 7 is bonded by using a solder 6; a multilayer wiring structure body is manufactured. A mixed layer formed at an interface between the polyimide and Al or Cu prevents water from penetrating because an ethyl group (-C2H5) as a hydrophobic group exists; in addition, the Al and the polyimide are bonded by laying a carbonyl group as a hydrophile group; a bonding force between both is enhanced. |
