发明名称 Method of manufacturing a substrate coated with multiple thick films
摘要 A method of manufacturing a substrate coated with a plurality of thick films wherein conductive layers are wholly prepared from conductive paste, and also a device comprising the substrate. The present invention offers the advantages that the drawbacks accompanying the conventional conductor of silver-palladium base are overcome by forming a resistor having a required resistivity and a high reproducibility. A conductive paste and insulative paste are fired at a lower temperature than that at which the resistor paste is fired, without reducing the adhesion strength of the conductive layer to the substrate. A low temperature melting point crystalline composition is used as an insulative layer to ensure that the resistance of the resistor is not adversely affected by repeated firings.
申请公布号 US4830878(A) 申请公布日期 1989.05.16
申请号 US19870071669 申请日期 1987.07.09
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KANEKO, TSUNEO;EZAKI, SHIRO
分类号 H01L27/01;H05K1/03;H05K1/09;H05K1/16;H05K3/46 主分类号 H01L27/01
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