发明名称 |
Method of manufacturing a substrate coated with multiple thick films |
摘要 |
A method of manufacturing a substrate coated with a plurality of thick films wherein conductive layers are wholly prepared from conductive paste, and also a device comprising the substrate. The present invention offers the advantages that the drawbacks accompanying the conventional conductor of silver-palladium base are overcome by forming a resistor having a required resistivity and a high reproducibility. A conductive paste and insulative paste are fired at a lower temperature than that at which the resistor paste is fired, without reducing the adhesion strength of the conductive layer to the substrate. A low temperature melting point crystalline composition is used as an insulative layer to ensure that the resistance of the resistor is not adversely affected by repeated firings.
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申请公布号 |
US4830878(A) |
申请公布日期 |
1989.05.16 |
申请号 |
US19870071669 |
申请日期 |
1987.07.09 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KANEKO, TSUNEO;EZAKI, SHIRO |
分类号 |
H01L27/01;H05K1/03;H05K1/09;H05K1/16;H05K3/46 |
主分类号 |
H01L27/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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