发明名称 PACKAGE STRUCTURE OF ELECTRIC COMPONENT
摘要 PURPOSE:To simplify the manufacture process by providing on a substrate a frame having a pair of vertical substrates opposed to each other with a spacing slightly larger than the width of the electric component therebetween, and providing on the inner side of the vertical substrates contact connectors, which press the connecting pins of the electric components from both sides thereby to hold the electric components. CONSTITUTION:On a substrate 21, a frame 24 is provided which has a pair of vertical substrates 25a, 25b opposed to each other with a spacing slightly larger than the width of electric component 22 therebetween. Also, the electric parts are inserted between the substrates 21 in a stacked relationship, and on the inner side of the vertical substrates 25a, 25b, contact connectors 32 are provided which press the connecting pins 23 of the electric parts from both sides thereby to hold the electric parts. When the electric components 22 are inserted between the vertical substrates 25a, 25b, the connecting pins 23 are pressed from both sides, whereby the connecting pins 23 and the contact connectors 32 are electrically connected. Also the electric parts 22 are held by the contact connectors 32. For this, the electric components 22 can be mounted by alternately stacking the electric components 22 and spacers 31. And by drawing out the electric parts 22 from between the vertical substrates 25a, 25b in the upward direction, they can be removed.
申请公布号 JPH01120887(A) 申请公布日期 1989.05.12
申请号 JP19870278253 申请日期 1987.11.05
申请人 NEC CORP 发明人 IGARASHI SHINICHI
分类号 H05K1/14;H05K1/18;H05K3/32 主分类号 H05K1/14
代理机构 代理人
主权项
地址