发明名称 COPPER POWDER FOR ELECTRICALLY CONDUCTIVE COATING MATERIAL AND MANUFACTURE OF SAID POWDER
摘要 PURPOSE:To obtain the title copper powder which has excellent storage stability and resistance to environment and gives a coating film with excellent adhesiveness, by incorporating a mixture of a titanium acylate polymer with a higher carboxylic acid ester into a copper powder dispersion bath and removing the dispersing medium if required. CONSTITUTION:A tetraalkoxytitanium is reacted with a carboxylic acid to give a titanium acylate polymer (A) having repeating units of any one of formulas I-III (wherein R and R1-3 are each a 1-25C hydrocarbon group). 40-80wt.% polymer A is mixed with 60-20wt.% higher carboxylic acid ester (B) comprising a 10-24C fatty acid ester. This mixture is incorporated into a dispersion bath (C) obtained by dispersing a copper powder having a specific surface area of 1.5m<2>/g or less, a particle size distribution ranging from 1 to 100mum, and a mean particle diameter of 3-30mum in a dispersing medium comprising water or an organic solvent, the amount of the mixture being 0.1-10wt.% based on component C. If required, said dispersing medium is removed, thus giving the title copper powder in which a molecular film of component B is formed in the apertures of component A covering the surface of component C.
申请公布号 JPH01108277(A) 申请公布日期 1989.04.25
申请号 JP19870264952 申请日期 1987.10.20
申请人 MITSUI MINING & SMELTING CO LTD 发明人 MITO KENTARO;SENZAKI HIROHISA;SOHAMA YOSHIO
分类号 B22F1/02;C08K9/04;C09C1/62;C09C1/66;C09C3/10;C09D5/24;C09D7/12;H01B1/00;H01B1/22;H05K1/09 主分类号 B22F1/02
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