发明名称 |
Method for forming cover layer over wire joint |
摘要 |
The invention provides an improved method for forming a cover layer over a joint of electrical wires. Portions of insulation layers of wires to be joined are stripped and the bared conductors of the wires assembled in a desired configuration to form a joint. The joint is placed in a transparent mold and the mold is filled with a photosetting resin. Radiation of an appropriate wavelength is then passed through the mold to harden the resin.
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申请公布号 |
US4822434(A) |
申请公布日期 |
1989.04.18 |
申请号 |
US19870126391 |
申请日期 |
1987.11.30 |
申请人 |
YAZAKI CORPORATION |
发明人 |
SAWAKI, ATSUSHI;ONO, MAMORU;OKAZAKI, TOSHIO;NARUSE, KOJI |
分类号 |
H01R43/00;B29C35/08;B29C39/10;B29C70/74;H01R4/70;H02G1/14;H02G15/00;(IPC1-7):H01B13/06;H01B13/08 |
主分类号 |
H01R43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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