| 摘要 |
<p>PURPOSE:To increase freedom of design and to increase packaging density by forming a multilayer structure using resin family conductor and resin insula tion film for compound multilayer substrate. CONSTITUTION:Ag family paste and copper paste are screen-printed on an aluminum substrate 2 for oxidation environment calcination and neutral environ ment calcination, respectively. After drying, it is calcined. Then, resistor paste such as compound type ruthenium chemical compound and resistor paste such as boron lantern family are screen-printed on a substrate 1 as a thick-film resistor 3 for oxidation environment calcination and for neutral environment calcination, respectively, as in a thick-film conductor. After drying, they are calcined. Then, after performing screen-printing of thermoset epoxy family resin paste on it as a resin insulation film 5, they are cured. Then, after performing screen-printing of thermoset resin family copper paste or thermoset resin family Ag paste on it as a resin family conductor 4, it is cured at 100-200 deg.C to turn it into a conductor.</p> |
