| 摘要 |
PURPOSE: To miniaturize an apparatus at a low cost without requiring a fin, by providing an infrared ray transmitting reflecting layer through an infrared ray absorbing layer on a reflecting surface of a substrate, and adhering a heat radiating plate with many holes to the opposite surface by heat conductive adhesive. CONSTITUTION: An infrared ray absorbing layer 3 comprising a layer 5 to which SiC or the like having a small infrared ray reflectance, a large absorbed amount of infrared ray and good adherence to a substrate material is deposited and a layer 6 to which TiC having good adherence to a reflecting layer 4 is deposited and an infrared ray transmitting reflecting layer 4 in which SiO2 and MgF2 formed into a multi-layer film, are laminated on the inner surface of a metal or ceramic substrate 2 formed alternatively in a rotative quadratic surface. A heat radiating plate 7 of steel sheet having many holes 8 is fixed to the external surface of the substrate 2 through highly heat conductive adhesive such as silicon oil compound. Heat of infrared ray absorbed by the absorbing layer 3 is transmitted to the heat radiating plate 7 and is radiated from a wide radiating surface. |
